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Megatrends
It’s a classic indicator of technological advancement: the more innovative a product gets, the smaller it becomes. Such was the case with technologies we now use every day, from cell phones to headphones. Since the advent of Moore’s Law, miniaturization has been a huge topic in the semiconductor industry. DELO stands at the ready with the adhesive and equipment solutions to further this trend, as these three of many examples illustrate.
Microdispensing
Bonding is integral in semiconductor assembly. As semiconductor chips continue to shrink whilst increasing their high-performance capabilities, there is a need for ultra-fine bonding applications. This is where DELO microdispensing equipment comes in. Devices such as the DELO-DOT PN5 and DELO-DOT PN5 LV provide thin bondlines applied with utmost precision, making them an ideal response to a perpetual trend.
While smaller quantities are relatively easy to achieve with low-viscosity products, jetting highly filled products, as is often necessary for more demanding applications, poses technical challenges.
This is because small quantities require small nozzles through which the adhesive is jetted, and a valve needs enough power for the filler particles to get through. Simultaneously, it is essential to prevent particle damage and nozzle clogging. Engineering tests with DELO-DOT PN5 have demonstrated that these criteria can be successfully met.
For example, droplet sizes with diameters of about 400 µm—comparable to a medium-sized grain of sand—can be achieved with silver-filled, isotropic-conductive DELO DUALBOND products.
RFID
One of the best examples of chip miniaturization is found in the field of RFID. Used in retail price tags, logistics, and many other applications, these ultra‑compact chips are paper‑thin and barely perceptible - measuring only 400 µm × 400 µm × 100 µm, with dimensions continuing to shrink.
DELO has developed a broad portfolio of aluminum‑ and copper‑friendly adhesives, engineered for optimal performance in RFID applications.
These adhesives enable the high‑speed assembly of RFID labels, reliably bonding and electrically connecting chips to antennas through jet dispensing and thermode curing.
Because of the chips’ tiny size, the adhesive must be dispensed with extreme precision and in minute quantities - many modern labels require as little as 0.02 mg of adhesive.
Click here to learn more about our RFID solutions.
Micro Dam
One process solution that further pushes the boundaries of miniaturization is micro dam stacking. Here, very small amounts of adhesive are dispensed through needles with diameters smaller than 100 µm, stacked consecutively, and lining the perimeter of the chip.
This prevents, for example, capillary underfills from coming into contact with surrounding components, creating small and clean keep‑out zones.
Tiny barriers measuring just 50 µm in width—comparable to a thin human hair—are feasible, with the adhesive layers achieving a final aspect ratio of 5 or more. Moreover, these layers can be applied within a very short time and without intermediate curing.
See the process in action here.
Here you can find more information on the topic of micro dam.
These have been just a few examples of ways DELO can serve as a one-stop solution for your company as it contributes to the trend of semiconductor miniaturization. Curious to find out how we can help with your use case?
With our assistance, as your products become smaller, your possibilities may ever-expand.
Innovation
DELO adhesives play a vital role in driving innovation across various megatrends, ensuring high performance and reliability in rapidly evolving technological landscapes. Discover how our solutions contribute to these exciting developments.
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
